Arrhenius modeling and controlled thermal oxidation of Si(100)
Examines silicon thermal oxidation using Deal-Grove modeling and a controlled laboratory run. Arrhenius analysis extracted activation energies from simulated growth data at multiple temperatures. A silicon wafer was thermally oxidized at 1000°C; oxide thickness was estimated by color comparison and characterized via SEM and AFM.
Plotted ln(rate constant) vs. 1/T (reciprocal absolute temperature).
Activation energies were extracted by multiplying the negative slope by Boltzmann's constant. Extracted values compared favorably to literature, particularly for the diffusion-limited (B) regime.
| Equipment | Details |
|---|---|
| Silicon wafer | Polished, Si(001) |
| Furnace | Thermo Scientific Lindberg Blue M |
| SEM | Tescan Mira 3 |
| AFM | Park Systems NX10 |
After oxidation, the wafer showed hues of carnation pink and red-violet under light. Using standard oxide color charts, these map to ~4200–6000 Å. The Deal-Grove simulation at 1000°C for 20 hours in dry O₂ predicted ~5600 Å. Because no O₂ was introduced during the actual run, growth was slower; the experimental thickness of ~4200 Å is consistent with ambient oxidation kinetics.
The work demonstrated silicon oxidation behavior and provided hands-on experience linking Deal-Grove simulation to experiment. The sensitivity of the model to boundary conditions (gas flow, pressure, initial thickness) was clear from the divergence between simulated and experimental results.
Future iterations: